Chile, Huawei sign ICT MOU

Wednesday, November 23, 2016

Chile's government has signed a technological transfer MOU with Chinese telecoms equipment supplier Huawei.

The agreement, which includes building an innovation center, was signed to coincide with the visit of Chinese President Xi Jinping to the South American nation.

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The signatories were the head of Chile telecoms regulator (Subtel) Rodrigo Ramírez and Huawei Chile's executive director Qin Hua.

Chile has been building relations with Asian countries with regard to technological cooperation in recent years.

In February, Chile and China signed an ICT collaboration agreement that includes China conducting a feasibility study on building a trans-Pacific fiber optic cable link.

In May last year, Huawei signed an agreement with Chile to build the first datacenter in Latin America designed specifically for housing data collected from space.

Also in May last year, Chile signed a bilateral accord in the area of ICT with Japan and in April 2015 it signed an ICT MOU with South Korea.